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High temperature reliability of lead-free solder joints in ..:
Amalu, Emeka H.
;
Ekere, Ndy N.
Journal of Materials Processing Technology. 212 (2012) 2 - p. 471-483 , 2012
Link:
https://doi.org/10.1016/j.jmatprotec.2011.10.011
RT Journal T1 <Title>High temperature reliability of lead-free solder joints in a flip chip assembly</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmatprotec.2011.10.011&Exemplar=1&LAN=DE A1 Amalu, Emeka H. A1 Ekere, Ndy N. PB Elsevier BV YR 2012 SN 0924-0136 JF Journal of Materials Processing Technology VO 212 IS 2 SP 471 OP 483 LK http://dx.doi.org/https://doi.org/10.1016/j.jmatprotec.2011.10.011 DO https://doi.org/10.1016/j.jmatprotec.2011.10.011 SF ELIB - SuUB Bremen
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