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1 Ergebnisse
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Modeling of interfacial void closure and prediction of bond..:
Peng, Y.
;
Li, Z.X.
;
Guo, W.
..
Journal of Materials Processing Technology. 324 (2024) - p. 118267 , 2024
Link:
https://doi.org/10.1016/j.jmatprotec.2023.118267
RT Journal T1 <Title>Modeling of interfacial void closure and prediction of bonding time in solid-state diffusion bonding</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmatprotec.2023.118267&Exemplar=1&LAN=DE A1 Peng, Y. A1 Li, Z.X. A1 Guo, W. A1 Xiong, J.T. A1 Li, J.L. PB Elsevier BV YR 2024 SN 0924-0136 JF Journal of Materials Processing Technology VO 324 SP 118267 LK http://dx.doi.org/https://doi.org/10.1016/j.jmatprotec.2023.118267 DO https://doi.org/10.1016/j.jmatprotec.2023.118267 SF ELIB - SuUB Bremen
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