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1 Ergebnisse
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Thermal curing mechanisms and cross-linking network structu..:
Li, Hui
;
Yang, Lei
;
Sun, Zijian
.
Journal of Molecular Graphics and Modelling. 131 (2024) - p. 108811 , 2024
Link:
https://doi.org/10.1016/j.jmgm.2024.108811
RT Journal T1 <Title>Thermal curing mechanisms and cross-linking network structure of a novel silicon-containing arylacetylene resin with 2,7-diethynylnaphthalene unit</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmgm.2024.108811&Exemplar=1&LAN=DE A1 Li, Hui A1 Yang, Lei A1 Sun, Zijian A1 Zhu, Weihua PB Elsevier BV YR 2024 SN 1093-3263 JF Journal of Molecular Graphics and Modelling VO 131 SP 108811 LK http://dx.doi.org/https://doi.org/10.1016/j.jmgm.2024.108811 DO https://doi.org/10.1016/j.jmgm.2024.108811 SF ELIB - SuUB Bremen
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