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A unified disconnection model of stress-driven grain bounda..:
Hua, Anping
;
Zhao, Junhua
Journal of the Mechanics and Physics of Solids. 183 (2024) - p. 105515 , 2024
Link:
https://doi.org/10.1016/j.jmps.2023.105515
RT Journal T1 <Title>A unified disconnection model of stress-driven grain boundary migration in nanocrystalline metals</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmps.2023.105515&Exemplar=1&LAN=DE A1 Hua, Anping A1 Zhao, Junhua PB Elsevier BV YR 2024 SN 0022-5096 JF Journal of the Mechanics and Physics of Solids VO 183 SP 105515 LK http://dx.doi.org/https://doi.org/10.1016/j.jmps.2023.105515 DO https://doi.org/10.1016/j.jmps.2023.105515 SF ELIB - SuUB Bremen
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