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Peridynamic fracture analysis of film–substrate systems:
Chu, Shiyuan
;
Bai, Jinshuai
;
Zhao, Zi-Long
...
Journal of the Mechanics and Physics of Solids. 191 (2024) - p. 105757 , 2024
Link:
https://doi.org/10.1016/j.jmps.2024.105757
RT Journal T1 <Title>Peridynamic fracture analysis of film–substrate systems</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmps.2024.105757&Exemplar=1&LAN=DE A1 Chu, Shiyuan A1 Bai, Jinshuai A1 Zhao, Zi-Long A1 Liu, Yan A1 Huang, Dan A1 Li, Bo A1 Li, Qunyang A1 Feng, Xi-Qiao PB Elsevier BV YR 2024 SN 0022-5096 JF Journal of the Mechanics and Physics of Solids VO 191 SP 105757 LK http://dx.doi.org/https://doi.org/10.1016/j.jmps.2024.105757 DO https://doi.org/10.1016/j.jmps.2024.105757 SF ELIB - SuUB Bremen
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