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Artifact-free microstructures of the Cu–In reaction by usin..:
Hung, H.T.
;
Lee, P.T.
;
Tsai, C.H.
.
Journal of Materials Research and Technology. 9 (2020) 6 - p. 12946-12954 , 2020
Link:
https://doi.org/10.1016/j.jmrt.2020.09.045
RT Journal T1 <Title>Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2020.09.045&Exemplar=1&LAN=DE A1 Hung, H.T. A1 Lee, P.T. A1 Tsai, C.H. A1 Kao, C.R. PB Elsevier BV YR 2020 SN 2238-7854 JF Journal of Materials Research and Technology VO 9 IS 6 SP 12946 OP 12954 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2020.09.045 DO https://doi.org/10.1016/j.jmrt.2020.09.045 SF ELIB - SuUB Bremen
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