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1 Ergebnisse
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Promoting the interface connection of hot-compression bonde..:
Qian, Dongsheng
;
Li, Wentao
;
Deng, Jiadong
..
Journal of Materials Research and Technology. 18 (2022) - p. 2140-2151 , 2022
Link:
https://doi.org/10.1016/j.jmrt.2022.03.128
RT Journal T1 <Title>Promoting the interface connection of hot-compression bonded stainless steel via introducing a novel electroshocking treatment</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2022.03.128&Exemplar=1&LAN=DE A1 Qian, Dongsheng A1 Li, Wentao A1 Deng, Jiadong A1 Wang, Feng A1 Wu, Min PB Elsevier BV YR 2022 SN 2238-7854 JF Journal of Materials Research and Technology VO 18 SP 2140 OP 2151 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2022.03.128 DO https://doi.org/10.1016/j.jmrt.2022.03.128 SF ELIB - SuUB Bremen
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