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1 Ergebnisse
1
Growth behavior and reliability of interfacial IMC for Sn58..:
Wang, Xi
;
Zhang, Liang
;
Wang, Xiao
...
Journal of Materials Research and Technology. 21 (2022) - p. 4263-4280 , 2022
Link:
https://doi.org/10.1016/j.jmrt.2022.11.013
RT Journal T1 <Title>Growth behavior and reliability of interfacial IMC for Sn58Bi/Cu and Sn58Bi–AlN/Cu solder joints applied in IGBT modules</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2022.11.013&Exemplar=1&LAN=DE A1 Wang, Xi A1 Zhang, Liang A1 Wang, Xiao A1 Guo, Yong-huan A1 Sun, Lei A1 Liu, Ying-xia A1 Chen, Chen A1 Lu, Xiao PB Elsevier BV YR 2022 SN 2238-7854 JF Journal of Materials Research and Technology VO 21 SP 4263 OP 4280 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2022.11.013 DO https://doi.org/10.1016/j.jmrt.2022.11.013 SF ELIB - SuUB Bremen
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