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1 Ergebnisse
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Mechanical properties and microstructure evolution of Cu/Sn..:
Chen, Chen
;
Zhang, Liang
;
Wang, Xi
...
Journal of Materials Research and Technology. 23 (2023) - p. 1225-1238 , 2023
Link:
https://doi.org/10.1016/j.jmrt.2023.01.077
RT Journal T1 <Title>Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2023.01.077&Exemplar=1&LAN=DE A1 Chen, Chen A1 Zhang, Liang A1 Wang, Xi A1 Lu, Xiao A1 Gao, Li-li A1 Zhao, Meng A1 Guo, Yong-huan PB Elsevier BV YR 2023 SN 2238-7854 JF Journal of Materials Research and Technology VO 23 SP 1225 OP 1238 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2023.01.077 DO https://doi.org/10.1016/j.jmrt.2023.01.077 SF ELIB - SuUB Bremen
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