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1 Ergebnisse
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Microstructure and brazing properties of a novel Ag–Cu-Ga s..:
Yang, Xiaoyu
;
He, Junjie
;
Xu, Siyong
...
Journal of Materials Research and Technology. 23 (2023) - p. 1515-1527 , 2023
Link:
https://doi.org/10.1016/j.jmrt.2023.01.109
RT Journal T1 <Title>Microstructure and brazing properties of a novel Ag–Cu-Ga solder</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2023.01.109&Exemplar=1&LAN=DE A1 Yang, Xiaoyu A1 He, Junjie A1 Xu, Siyong A1 Zhang, Dechuan A1 Fu, Li A1 Zhang, Shunmeng A1 Kai, Xiong A1 Zhang, Xinpei A1 Pi, Lin A1 Mao, Yong PB Elsevier BV YR 2023 SN 2238-7854 JF Journal of Materials Research and Technology VO 23 SP 1515 OP 1527 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2023.01.109 DO https://doi.org/10.1016/j.jmrt.2023.01.109 SF ELIB - SuUB Bremen
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