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1 Ergebnisse
1
Highly dynamic tempered in-mold thermocompression bonding o..:
Zhao, Baishun
;
Wu, Wangqing
;
Zhou, Mingyong
..
Journal of Materials Research and Technology. 24 (2023) - p. 639-652 , 2023
Link:
https://doi.org/10.1016/j.jmrt.2023.03.040
RT Journal T1 <Title>Highly dynamic tempered in-mold thermocompression bonding of microfluidic chips: process characteristics and bonding performances</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2023.03.040&Exemplar=1&LAN=DE A1 Zhao, Baishun A1 Wu, Wangqing A1 Zhou, Mingyong A1 Jiang, Bingyan A1 Ziegmann, Gerhard PB Elsevier BV YR 2023 SN 2238-7854 JF Journal of Materials Research and Technology VO 24 SP 639 OP 652 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2023.03.040 DO https://doi.org/10.1016/j.jmrt.2023.03.040 SF ELIB - SuUB Bremen
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