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1 Ergebnisse
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Microstructures and mechanical properties of ENIG/Sn-3.5Ag/..:
Kim, Hyeon-Tae
;
Yoon, Jeong-Won
Journal of Materials Research and Technology. 24 (2023) - p. 4468-4483 , 2023
Link:
https://doi.org/10.1016/j.jmrt.2023.04.097
RT Journal T1 <Title>Microstructures and mechanical properties of ENIG/Sn-3.5Ag/ENIG joints formed by ultrasonic-assisted solder bonding</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2023.04.097&Exemplar=1&LAN=DE A1 Kim, Hyeon-Tae A1 Yoon, Jeong-Won PB Elsevier BV YR 2023 SN 2238-7854 JF Journal of Materials Research and Technology VO 24 SP 4468 OP 4483 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2023.04.097 DO https://doi.org/10.1016/j.jmrt.2023.04.097 SF ELIB - SuUB Bremen
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