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1 Ergebnisse
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Effect of sputtering process parameters on the uniformity o..:
Yin, Zhendong
;
Lin, Songsheng
;
Fu, Zhiqiang
...
Journal of Materials Research and Technology. 25 (2023) - p. 5249-5259 , 2023
Link:
https://doi.org/10.1016/j.jmrt.2023.06.243
RT Journal T1 <Title>Effect of sputtering process parameters on the uniformity of copper film deposited in micro-via</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2023.06.243&Exemplar=1&LAN=DE A1 Yin, Zhendong A1 Lin, Songsheng A1 Fu, Zhiqiang A1 Wang, Yao A1 Hu, Chuan A1 Su, Yifan PB Elsevier BV YR 2023 SN 2238-7854 JF Journal of Materials Research and Technology VO 25 SP 5249 OP 5259 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2023.06.243 DO https://doi.org/10.1016/j.jmrt.2023.06.243 SF ELIB - SuUB Bremen
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