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1 Ergebnisse
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Interface bonding mechanism and microstructure evolution in..:
Bi, Yuanbo
;
Zhang, Xueliang
;
Lu, Li
...
Journal of Materials Research and Technology. 26 (2023) - p. 5888-5901 , 2023
Link:
https://doi.org/10.1016/j.jmrt.2023.09.007
RT Journal T1
Interface bonding mechanism and microstructure evolution in current-induced solid-state welding of Zr–Sn/Zr–Sn–Nb alloy
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2023.09.007&Exemplar=1&LAN=DE A1 Bi, Yuanbo A1 Zhang, Xueliang A1 Lu, Li A1 Xu, Zhongfeng A1 Xie, Zhigang A1 Chen, Bingbing A1 Liang, Zhenxin A1 Sun, Zhiqiang A1 Luo, Zhen PB Elsevier BV YR 2023 SN 2238-7854 JF Journal of Materials Research and Technology VO 26 SP 5888 OP 5901 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2023.09.007 DO https://doi.org/10.1016/j.jmrt.2023.09.007 SF ELIB - SuUB Bremen
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