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1 Ergebnisse
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Transient liquid phase bonding using Cu foam and Cu–Sn past..:
Heo, Min-Haeng
;
Seo, Young-Jin
;
Yoon, Jeong-Won
Journal of Materials Research and Technology. 27 (2023) - p. 2856-2867 , 2023
Link:
https://doi.org/10.1016/j.jmrt.2023.10.184
RT Journal T1
Transient liquid phase bonding using Cu foam and Cu–Sn paste for high-temperature applications
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2023.10.184&Exemplar=1&LAN=DE A1 Heo, Min-Haeng A1 Seo, Young-Jin A1 Yoon, Jeong-Won PB Elsevier BV YR 2023 SN 2238-7854 JF Journal of Materials Research and Technology VO 27 SP 2856 OP 2867 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2023.10.184 DO https://doi.org/10.1016/j.jmrt.2023.10.184 SF ELIB - SuUB Bremen
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