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1 Ergebnisse
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Microstructural effects of copper deposits on direct bondin..:
Xie, Zong-Yu
;
Huang, Po-Kai
;
Lu, Yin-Chi
...
Journal of Materials Research and Technology. 28 (2024) - p. 1657-1666 , 2024
Link:
https://doi.org/10.1016/j.jmrt.2023.12.039
RT Journal T1 <Title>Microstructural effects of copper deposits on direct bonding for 3D IC integration</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2023.12.039&Exemplar=1&LAN=DE A1 Xie, Zong-Yu A1 Huang, Po-Kai A1 Lu, Yin-Chi A1 Kao, Golden A1 Hung, Chih-Pin A1 Yasuda, Kiyokazu A1 Song, Jenn-Ming PB Elsevier BV YR 2024 SN 2238-7854 JF Journal of Materials Research and Technology VO 28 SP 1657 OP 1666 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2023.12.039 DO https://doi.org/10.1016/j.jmrt.2023.12.039 SF ELIB - SuUB Bremen
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