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Mechanical characterizations of η′-Cu6(Sn, In)5 intermetall..:
Mao, Xingchao
;
An, Yuxuan
;
Chen, Yang
...
Journal of Materials Research and Technology. 30 (2024) - p. 1136-1147 , 2024
Link:
https://doi.org/10.1016/j.jmrt.2024.03.146
RT Journal T1 <Title>Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2024.03.146&Exemplar=1&LAN=DE A1 Mao, Xingchao A1 An, Yuxuan A1 Chen, Yang A1 Zheng, Gong A1 Hou, Rui A1 Zhang, Xinyu A1 Guo, Yuzheng A1 Liu, Sheng A1 Tu, King-Ning A1 Liu, Yingxia PB Elsevier BV YR 2024 SN 2238-7854 JF Journal of Materials Research and Technology VO 30 SP 1136 OP 1147 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2024.03.146 DO https://doi.org/10.1016/j.jmrt.2024.03.146 SF ELIB - SuUB Bremen
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