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1 Ergebnisse
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An innovative high-entropy alloy solder for high-reliabilit..:
Chen, Yini
;
Wang, Jintao
;
Lv, Ziwen
...
Journal of Materials Research and Technology. 30 (2024) - p. 5622-5631 , 2024
Link:
https://doi.org/10.1016/j.jmrt.2024.04.257
RT Journal T1 <Title>An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2024.04.257&Exemplar=1&LAN=DE A1 Chen, Yini A1 Wang, Jintao A1 Lv, Ziwen A1 Wang, Jianqiang A1 Tian, Feng A1 Zhang, Luobin A1 Zhang, Weiwei A1 Chen, Hongtao A1 Li, Mingyu PB Elsevier BV YR 2024 SN 2238-7854 JF Journal of Materials Research and Technology VO 30 SP 5622 OP 5631 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2024.04.257 DO https://doi.org/10.1016/j.jmrt.2024.04.257 SF ELIB - SuUB Bremen
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