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1 Ergebnisse
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Reactive diffusion at the interface between Cu and Sn–Ag al..:
Oh, Minho
;
Tokunaga, Naru
;
Kobayashi, Equo
Journal of Materials Research and Technology. 30 (2024) - p. 9531-9541 , 2024
Link:
https://doi.org/10.1016/j.jmrt.2024.06.048
RT Journal T1 <Title>Reactive diffusion at the interface between Cu and Sn–Ag alloys</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jmrt.2024.06.048&Exemplar=1&LAN=DE A1 Oh, Minho A1 Tokunaga, Naru A1 Kobayashi, Equo PB Elsevier BV YR 2024 SN 2238-7854 JF Journal of Materials Research and Technology VO 30 SP 9531 OP 9541 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2024.06.048 DO https://doi.org/10.1016/j.jmrt.2024.06.048 SF ELIB - SuUB Bremen
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