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1 Ergebnisse
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Mechanism of over-etching defects during Ta/TaN barrier res..:
Tsao, Jung-Chih
;
Liu, Chuan-Pu
;
Wang, Ying-Lang
..
Journal of Physics and Chemistry of Solids. 69 (2008) 2-3 - p. 561-565 , 2008
Link:
https://doi.org/10.1016/j.jpcs.2007.07.072
RT Journal T1 <Title>Mechanism of over-etching defects during Ta/TaN barrier resputtering in micro-trench for Cu metallization</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jpcs.2007.07.072&Exemplar=1&LAN=DE A1 Tsao, Jung-Chih A1 Liu, Chuan-Pu A1 Wang, Ying-Lang A1 Chen, Kei-Wei A1 Lo, Kuang-Yao PB Elsevier BV YR 2008 SN 0022-3697 JF Journal of Physics and Chemistry of Solids VO 69 IS 2-3 SP 561 OP 565 LK http://dx.doi.org/https://doi.org/10.1016/j.jpcs.2007.07.072 DO https://doi.org/10.1016/j.jpcs.2007.07.072 SF ELIB - SuUB Bremen
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