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1 Ergebnisse
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Direct surface in-situ activation for electroless depositio..:
Wang, Yuefeng
;
Hong, Yan
;
Chen, Qingguo
...
Journal of the Taiwan Institute of Chemical Engineers. 97 (2019) - p. 450-457 , 2019
Link:
https://doi.org/10.1016/j.jtice.2019.02.014
RT Journal T1 <Title>Direct surface in-situ activation for electroless deposition of robust conductive copper patterns on polyimide film</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jtice.2019.02.014&Exemplar=1&LAN=DE A1 Wang, Yuefeng A1 Hong, Yan A1 Chen, Qingguo A1 Zhou, Guoyun A1 He, Wei A1 Gao, Zhengping A1 Zhou, Xin A1 Zhang, Weihua A1 Su, Xinhong A1 Sun, Rui PB Elsevier BV YR 2019 SN 1876-1070 JF Journal of the Taiwan Institute of Chemical Engineers VO 97 SP 450 OP 457 LK http://dx.doi.org/https://doi.org/10.1016/j.jtice.2019.02.014 DO https://doi.org/10.1016/j.jtice.2019.02.014 SF ELIB - SuUB Bremen
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