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1 Ergebnisse
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Microstructure changes in Sn-Bi solder joints reinforced wi..:
WANG, Fengyi
;
LV, Ziwen
;
Sun, Linxiao
..
Journal of the Taiwan Institute of Chemical Engineers. 146 (2023) - p. 104871 , 2023
Link:
https://doi.org/10.1016/j.jtice.2023.104871
RT Journal T1 <Title>Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jtice.2023.104871&Exemplar=1&LAN=DE A1 WANG, Fengyi A1 LV, Ziwen A1 Sun, Linxiao A1 CHEN, Hongtao A1 LI, Mingyu PB Elsevier BV YR 2023 SN 1876-1070 JF Journal of the Taiwan Institute of Chemical Engineers VO 146 SP 104871 LK http://dx.doi.org/https://doi.org/10.1016/j.jtice.2023.104871 DO https://doi.org/10.1016/j.jtice.2023.104871 SF ELIB - SuUB Bremen
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