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1 Ergebnisse
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Application of the Taguchi method to minimize the non-unifo..:
Yu, Shun-Hsuan
;
Kao, Chuan-Ping
;
Ma, Chun-Wei
...
Journal of the Taiwan Institute of Chemical Engineers. 156 (2024) - p. 105379 , 2024
Link:
https://doi.org/10.1016/j.jtice.2024.105379
RT Journal T1 <Title>Application of the Taguchi method to minimize the non-uniformity of copper deposition in electroplating with numerical model</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jtice.2024.105379&Exemplar=1&LAN=DE A1 Yu, Shun-Hsuan A1 Kao, Chuan-Ping A1 Ma, Chun-Wei A1 Fang, Jen-Kuang A1 Yang, Ping-Feng A1 Chang, Hou-Chien PB Elsevier BV YR 2024 SN 1876-1070 JF Journal of the Taiwan Institute of Chemical Engineers VO 156 SP 105379 LK http://dx.doi.org/https://doi.org/10.1016/j.jtice.2024.105379 DO https://doi.org/10.1016/j.jtice.2024.105379 SF ELIB - SuUB Bremen
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