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Synergistic effects of additives on impurity residues in hi..:
Tsai, Kun-Lin
;
Chen, Chih-Ming
;
Ho, Cheng-En
Journal of the Taiwan Institute of Chemical Engineers. 156 (2024) - p. 105391 , 2024
Link:
https://doi.org/10.1016/j.jtice.2024.105391
RT Journal T1 <Title>Synergistic effects of additives on impurity residues in high-speed copper electrodeposition and voiding propensity in solder joints</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.jtice.2024.105391&Exemplar=1&LAN=DE A1 Tsai, Kun-Lin A1 Chen, Chih-Ming A1 Ho, Cheng-En PB Elsevier BV YR 2024 SN 1876-1070 JF Journal of the Taiwan Institute of Chemical Engineers VO 156 SP 105391 LK http://dx.doi.org/https://doi.org/10.1016/j.jtice.2024.105391 DO https://doi.org/10.1016/j.jtice.2024.105391 SF ELIB - SuUB Bremen
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