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1 Ergebnisse
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Interfacial bonding mechanisms in ultrasonic-assisted solde..:
Li, Wenzhao
;
Ding, Zhijie
;
Xue, Haitao
...
Materials Characterization. 199 (2023) - p. 112833 , 2023
Link:
https://doi.org/10.1016/j.matchar.2023.112833
RT Journal T1 <Title>Interfacial bonding mechanisms in ultrasonic-assisted soldered Si/Cu joint using Sn-3.5Ag-4Al solder</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.matchar.2023.112833&Exemplar=1&LAN=DE A1 Li, Wenzhao A1 Ding, Zhijie A1 Xue, Haitao A1 Guo, Weibing A1 Chen, Cuixin A1 Jia, Yang A1 Wan, Zheng PB Elsevier BV YR 2023 SN 1044-5803 JF Materials Characterization VO 199 SP 112833 LK http://dx.doi.org/https://doi.org/10.1016/j.matchar.2023.112833 DO https://doi.org/10.1016/j.matchar.2023.112833 SF ELIB - SuUB Bremen
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