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1 Ergebnisse
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Ultrasonic-enhanced silver‑indium transient liquid phase bo..:
Song, Jiaqi
;
Zhang, Donglin
;
Chen, Xin
...
Materials Characterization. 210 (2024) - p. 113793 , 2024
Link:
https://doi.org/10.1016/j.matchar.2024.113793
RT Journal T1
Ultrasonic-enhanced silver‑indium transient liquid phase bonding in advancing rapid and low-temperature packaging
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.matchar.2024.113793&Exemplar=1&LAN=DE A1 Song, Jiaqi A1 Zhang, Donglin A1 Chen, Xin A1 Hu, Shizun A1 Zhao, Xiuchen A1 Lee, Chin C. A1 Huo, Yongjun PB Elsevier BV YR 2024 SN 1044-5803 JF Materials Characterization VO 210 SP 113793 LK http://dx.doi.org/https://doi.org/10.1016/j.matchar.2024.113793 DO https://doi.org/10.1016/j.matchar.2024.113793 SF ELIB - SuUB Bremen
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