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1 Ergebnisse
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A new method for preparation of direct bonding copper subst..:
He, Hong
;
Fu, Renli
;
Wang, Deliu
..
Materials Letters. 61 (2007) 19-20 - p. 4131-4133 , 2007
Link:
https://doi.org/10.1016/j.matlet.2007.01.036
RT Journal T1
A new method for preparation of direct bonding copper substrate on Al2O3
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.matlet.2007.01.036&Exemplar=1&LAN=DE A1 He, Hong A1 Fu, Renli A1 Wang, Deliu A1 Song, Xiufeng A1 Jing, Min PB Elsevier BV YR 2007 SN 0167-577X JF Materials Letters VO 61 IS 19-20 SP 4131 OP 4133 LK http://dx.doi.org/https://doi.org/10.1016/j.matlet.2007.01.036 DO https://doi.org/10.1016/j.matlet.2007.01.036 SF ELIB - SuUB Bremen
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