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1 Ergebnisse
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Copper diffusion into epoxy under high temperature:
Zhao, Shuaijie
;
Chen, Chuantong
;
Nishijima, Masahiko
...
Materials Letters. 361 (2024) - p. 136157 , 2024
Link:
https://doi.org/10.1016/j.matlet.2024.136157
RT Journal T1
Copper diffusion into epoxy under high temperature
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.matlet.2024.136157&Exemplar=1&LAN=DE A1 Zhao, Shuaijie A1 Chen, Chuantong A1 Nishijima, Masahiko A1 Haga, Motoharu A1 Ueshima, Minoru A1 Suzuki, Hirose A1 Takenaka, Hiroto A1 Suganuma, Katsuaki PB Elsevier BV YR 2024 SN 0167-577X JF Materials Letters VO 361 SP 136157 LK http://dx.doi.org/https://doi.org/10.1016/j.matlet.2024.136157 DO https://doi.org/10.1016/j.matlet.2024.136157 SF ELIB - SuUB Bremen
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