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1 Ergebnisse
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Study on the design and fabrication of Silicon-Based integr..:
Xu, Pan
;
An, Ning
;
Yang, Zhenzhong
...
Measurement. 233 (2024) - p. 114741 , 2024
Link:
https://doi.org/10.1016/j.measurement.2024.114741
RT Journal T1
Study on the design and fabrication of Silicon-Based integrated current sensor based on 3D Through-Silicon-Via (TSV) Rogowski coil
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.measurement.2024.114741&Exemplar=1&LAN=DE A1 Xu, Pan A1 An, Ning A1 Yang, Zhenzhong A1 Wang, Yuexing A1 Zhou, Quanfeng A1 Deng, Shuairong A1 Sun, Xiangyu PB Elsevier BV YR 2024 SN 0263-2241 JF Measurement VO 233 SP 114741 LK http://dx.doi.org/https://doi.org/10.1016/j.measurement.2024.114741 DO https://doi.org/10.1016/j.measurement.2024.114741 SF ELIB - SuUB Bremen
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