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Improvement of thermal stability of Ni silicide on N+–Si by..:
Tsutsui, Kazuo
;
Shiozawa, Takashi
;
Nagahiro, Koji
...
Microelectronic Engineering. 85 (2008) 10 - p. 2000-2004 , 2008
Link:
https://doi.org/10.1016/j.mee.2008.04.040
RT Journal T1
Improvement of thermal stability of Ni silicide on N+–Si by direct deposition of group III element (Al, B) thin film at Ni/Si interface
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mee.2008.04.040&Exemplar=1&LAN=DE A1 Tsutsui, Kazuo A1 Shiozawa, Takashi A1 Nagahiro, Koji A1 Ohishi, Yoshihisa A1 Kakushima, Kuniyuki A1 Ahmet, Parhat A1 Urushihara, Nobuyuki A1 Suzuki, Mineharu A1 Iwai, Hiroshi PB Elsevier BV YR 2008 SN 0167-9317 JF Microelectronic Engineering VO 85 IS 10 SP 2000 OP 2004 LK http://dx.doi.org/https://doi.org/10.1016/j.mee.2008.04.040 DO https://doi.org/10.1016/j.mee.2008.04.040 SF ELIB - SuUB Bremen
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