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1 Ergebnisse
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Influence of NH3 plasma treatment on chemical bonding and w..:
Guo, Hao-Wen
;
Zhu, Lian
;
Zhang, Lei
...
Microelectronic Engineering. 85 (2008) 10 - p. 2114-2117 , 2008
Link:
https://doi.org/10.1016/j.mee.2008.05.032
RT Journal T1
Influence of NH3 plasma treatment on chemical bonding and water adsorption of low-k SiCOH film
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mee.2008.05.032&Exemplar=1&LAN=DE A1 Guo, Hao-Wen A1 Zhu, Lian A1 Zhang, Lei A1 Ding, Shi-Jin A1 Zhang, David Wei A1 Liu, Ran PB Elsevier BV YR 2008 SN 0167-9317 JF Microelectronic Engineering VO 85 IS 10 SP 2114 OP 2117 LK http://dx.doi.org/https://doi.org/10.1016/j.mee.2008.05.032 DO https://doi.org/10.1016/j.mee.2008.05.032 SF ELIB - SuUB Bremen
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