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1 Ergebnisse
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Study of low temperature MOCVD deposition of TiN barrier la..:
Djomeni, Larissa
;
Mourier, Thierry
;
Minoret, Stéphane
...
Microelectronic Engineering. 120 (2014) - p. 127-132 , 2014
Link:
https://doi.org/10.1016/j.mee.2013.11.010
RT Journal T1
Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mee.2013.11.010&Exemplar=1&LAN=DE A1 Djomeni, Larissa A1 Mourier, Thierry A1 Minoret, Stéphane A1 Fadloun, Sabrina A1 Piallat, Fabien A1 Burgess, Steve A1 Price, Andrew A1 Zhou, Yun A1 Jones, Christopher A1 Mathiot, Daniel A1 Maitrejean, Sylvain PB Elsevier BV YR 2014 SN 0167-9317 JF Microelectronic Engineering VO 120 SP 127 OP 132 LK http://dx.doi.org/https://doi.org/10.1016/j.mee.2013.11.010 DO https://doi.org/10.1016/j.mee.2013.11.010 SF ELIB - SuUB Bremen
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