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1 Ergebnisse
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Reliability evaluation of ultra thin 3D-IC package under th..:
Lee, Chang-Chun
;
Lin, Yu-Min
;
Liu, Hou-Chun
...
Microelectronic Engineering. 244-246 (2021) - p. 111572 , 2021
Link:
https://doi.org/10.1016/j.mee.2021.111572
RT Journal T1
Reliability evaluation of ultra thin 3D-IC package under the coupling load effects of the manufacturing process and temperature cycling test
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mee.2021.111572&Exemplar=1&LAN=DE A1 Lee, Chang-Chun A1 Lin, Yu-Min A1 Liu, Hou-Chun A1 Syu, Ji-Yuan A1 Huang, Yuan-Cheng A1 Chang, Tao-Chih PB Elsevier BV YR 2021 SN 0167-9317 JF Microelectronic Engineering VO 244-246 SP 111572 LK http://dx.doi.org/https://doi.org/10.1016/j.mee.2021.111572 DO https://doi.org/10.1016/j.mee.2021.111572 SF ELIB - SuUB Bremen
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