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In-situ characterization of thermomechanical behavior of co..:
Ayoub, Bassel
;
Moreau, Stéphane
;
Lhostis, Sandrine
...
Microelectronic Engineering. 261 (2022) - p. 111809 , 2022
Link:
https://doi.org/10.1016/j.mee.2022.111809
RT Journal T1
In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mee.2022.111809&Exemplar=1&LAN=DE A1 Ayoub, Bassel A1 Moreau, Stéphane A1 Lhostis, Sandrine A1 Frémont, Hélène A1 Mermoz, Sébastien A1 Souchier, Emeline A1 Deloffre, Emilie A1 Escoubas, Stéphanie A1 Cornelius, Thomas W. A1 Thomas, Olivier PB Elsevier BV YR 2022 SN 0167-9317 JF Microelectronic Engineering VO 261 SP 111809 LK http://dx.doi.org/https://doi.org/10.1016/j.mee.2022.111809 DO https://doi.org/10.1016/j.mee.2022.111809 SF ELIB - SuUB Bremen
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