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1 Ergebnisse
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Stress Issue of Vertical Connections in 3D Integration for ..:
Hung, Tzu-Heng
;
Pan, Yu-Ming
;
Chen, Kuan-Neng
Memories - Materials, Devices, Circuits and Systems. 4 (2023) - p. 100024 , 2023
Link:
https://doi.org/10.1016/j.memori.2023.100024
RT Journal T1 <Title>Stress Issue of Vertical Connections in 3D Integration for High-Bandwidth Memory Applications</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.memori.2023.100024&Exemplar=1&LAN=DE A1 Hung, Tzu-Heng A1 Pan, Yu-Ming A1 Chen, Kuan-Neng PB Elsevier BV YR 2023 SN 2773-0646 JF Memories - Materials, Devices, Circuits and Systems VO 4 SP 100024 LK http://dx.doi.org/https://doi.org/10.1016/j.memori.2023.100024 DO https://doi.org/10.1016/j.memori.2023.100024 SF ELIB - SuUB Bremen
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