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1 Ergebnisse
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Fatigue behavior of 3D stacked packaging structures under e..:
Xu, Xin
;
Liu, Yang
;
Su, Yahui
...
Memories - Materials, Devices, Circuits and Systems. 4 (2023) - p. 100032 , 2023
Link:
https://doi.org/10.1016/j.memori.2023.100032
RT Journal T1 <Title>Fatigue behavior of 3D stacked packaging structures under extreme thermal cycling condition</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.memori.2023.100032&Exemplar=1&LAN=DE A1 Xu, Xin A1 Liu, Yang A1 Su, Yahui A1 Sun, Cong A1 Xue, Yuxiong A1 Ju, Lina A1 Zhang, Shuye PB Elsevier BV YR 2023 SN 2773-0646 JF Memories - Materials, Devices, Circuits and Systems VO 4 SP 100032 LK http://dx.doi.org/https://doi.org/10.1016/j.memori.2023.100032 DO https://doi.org/10.1016/j.memori.2023.100032 SF ELIB - SuUB Bremen
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