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1 Ergebnisse
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Influence of underfill materials on the reliability of core..:
Chuang, Chun-Chih
;
Yang, Tsung-Fu
;
Juang, Jin-Ye
...
Microelectronics Reliability. 48 (2008) 11-12 - p. 1875-1881 , 2008
Link:
https://doi.org/10.1016/j.microrel.2008.09.005
RT Journal T1
Influence of underfill materials on the reliability of coreless flip chip package
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.microrel.2008.09.005&Exemplar=1&LAN=DE A1 Chuang, Chun-Chih A1 Yang, Tsung-Fu A1 Juang, Jin-Ye A1 Hung, Yin-Po A1 Zhan, Chau-Jie A1 Lin, Yu-Min A1 Lin, Ching-Tsung A1 Chang, Pei-Chen A1 Chang, Tao-Chih PB Elsevier BV YR 2008 SN 0026-2714 JF Microelectronics Reliability VO 48 IS 11-12 SP 1875 OP 1881 LK http://dx.doi.org/https://doi.org/10.1016/j.microrel.2008.09.005 DO https://doi.org/10.1016/j.microrel.2008.09.005 SF ELIB - SuUB Bremen
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