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1 Ergebnisse
1
IR thermography and FEM simulation analysis of on-chip temp..:
Köck, Helmut
;
Košel, Vladimir
;
Djelassi, Christian
..
Microelectronics Reliability. 49 (2009) 9-11 - p. 1132-1136 , 2009
Link:
https://doi.org/10.1016/j.microrel.2009.06.032
RT Journal T1
IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.microrel.2009.06.032&Exemplar=1&LAN=DE A1 Köck, Helmut A1 Košel, Vladimir A1 Djelassi, Christian A1 Glavanovics, Michael A1 Pogany, Dionyz PB Elsevier BV YR 2009 SN 0026-2714 JF Microelectronics Reliability VO 49 IS 9-11 SP 1132 OP 1136 LK http://dx.doi.org/https://doi.org/10.1016/j.microrel.2009.06.032 DO https://doi.org/10.1016/j.microrel.2009.06.032 SF ELIB - SuUB Bremen
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