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1 Ergebnisse
1
Design, assembly and reliability of large die and fine-pitc..:
Ong, Yue Ying
;
Ho, Soon Wee
;
Vaidyanathan, Kripesh
...
Microelectronics Reliability. 50 (2010) 7 - p. 986-994 , 2010
Link:
https://doi.org/10.1016/j.microrel.2010.03.010
RT Journal T1
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.microrel.2010.03.010&Exemplar=1&LAN=DE A1 Ong, Yue Ying A1 Ho, Soon Wee A1 Vaidyanathan, Kripesh A1 Sekhar, Vasarla Nagendra A1 Jong, Ming Chinq A1 Yak Long, Samuel Lim A1 Wen Sheng, Vincent Lee A1 Wai, Leong Ching A1 Rao, Vempati Srinivasa A1 Ong, Jimmy A1 Ong, Xuefen A1 Zhang, Xiaowu A1 Seung, Yoon Uk A1 Lau, John H. A1 Lim, Yeow Kheng A1 Yeo, David A1 Chan, Kai Chong A1 Yanfeng, Zhang A1 Tan, Juan Boon A1 Sohn, Dong Kyun PB Elsevier BV YR 2010 SN 0026-2714 JF Microelectronics Reliability VO 50 IS 7 SP 986 OP 994 LK http://dx.doi.org/https://doi.org/10.1016/j.microrel.2010.03.010 DO https://doi.org/10.1016/j.microrel.2010.03.010 SF ELIB - SuUB Bremen
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