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1 Ergebnisse
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Four-point bending cycling: The alternative for thermal cyc..:
Vandevelde, Bart
;
Vanhee, Filip
;
Pissoort, Davy
...
Microelectronics Reliability. 74 (2017) - p. 131-135 , 2017
Link:
https://doi.org/10.1016/j.microrel.2017.04.008
RT Journal T1
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.microrel.2017.04.008&Exemplar=1&LAN=DE A1 Vandevelde, Bart A1 Vanhee, Filip A1 Pissoort, Davy A1 Degrendele, Lieven A1 De Baets, Johan A1 Allaert, Bart A1 Lauwaert, Ralph A1 Zanon, Franco A1 Labie, Riet A1 Willems, Geert PB Elsevier BV YR 2017 SN 0026-2714 JF Microelectronics Reliability VO 74 SP 131 OP 135 LK http://dx.doi.org/https://doi.org/10.1016/j.microrel.2017.04.008 DO https://doi.org/10.1016/j.microrel.2017.04.008 SF ELIB - SuUB Bremen
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