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1 Ergebnisse
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Editorial: IEDMS 2016:
Liu, Chuan-Hsi
;
Cheng, Chun-Hu
;
Cheng, Chin-Pao
.
Microelectronics Reliability. 83 (2018) - p. 207 , 2018
Link:
https://doi.org/10.1016/j.microrel.2017.12.037
RT Journal T1 <Title>Editorial: IEDMS 2016</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.microrel.2017.12.037&Exemplar=1&LAN=DE A1 Liu, Chuan-Hsi A1 Cheng, Chun-Hu A1 Cheng, Chin-Pao A1 Liou, Juin J. PB Elsevier BV YR 2018 SN 0026-2714 JF Microelectronics Reliability VO 83 SP 207 LK http://dx.doi.org/https://doi.org/10.1016/j.microrel.2017.12.037 DO https://doi.org/10.1016/j.microrel.2017.12.037 SF ELIB - SuUB Bremen
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