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Design guideline on board-level thermomechanical reliabilit..:
Shao, Shuai
;
Niu, Yuling
;
Wang, Jing
...
Microelectronics Reliability. 111 (2020) - p. 113701 , 2020
Link:
https://doi.org/10.1016/j.microrel.2020.113701
RT Journal T1
Design guideline on board-level thermomechanical reliability of 2.5D package
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.microrel.2020.113701&Exemplar=1&LAN=DE A1 Shao, Shuai A1 Niu, Yuling A1 Wang, Jing A1 Liu, Ruiyang A1 Park, Seungbae A1 Lee, Hohyung A1 Yip, Laurene A1 Refai-Ahmed, Gamal PB Elsevier BV YR 2020 SN 0026-2714 JF Microelectronics Reliability VO 111 SP 113701 LK http://dx.doi.org/https://doi.org/10.1016/j.microrel.2020.113701 DO https://doi.org/10.1016/j.microrel.2020.113701 SF ELIB - SuUB Bremen
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