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1 Ergebnisse
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Thermal reliability of Cu sintering joints for high-tempera..:
Son, Junhyuk
;
Yu, Dong-Yurl
;
Kim, Yun-Chan
...
Microelectronics Reliability. 147 (2023) - p. 115002 , 2023
Link:
https://doi.org/10.1016/j.microrel.2023.115002
RT Journal T1
Thermal reliability of Cu sintering joints for high-temperature die attach
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.microrel.2023.115002&Exemplar=1&LAN=DE A1 Son, Junhyuk A1 Yu, Dong-Yurl A1 Kim, Yun-Chan A1 Kim, Shin-Il A1 Byun, Dongjin A1 Bang, Junghwan PB Elsevier BV YR 2023 SN 0026-2714 JF Microelectronics Reliability VO 147 SP 115002 LK http://dx.doi.org/https://doi.org/10.1016/j.microrel.2023.115002 DO https://doi.org/10.1016/j.microrel.2023.115002 SF ELIB - SuUB Bremen
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