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Optimal performance and cost-effective design of BGA solder..:
Ghenam, Sinda
;
El Hami, Abdelkhalak
;
Gafsi, Wajih
..
Microelectronics Reliability. 146 (2023) - p. 115019 , 2023
Link:
https://doi.org/10.1016/j.microrel.2023.115019
RT Journal T1
Optimal performance and cost-effective design of BGA solder joints using a deterministic design optimization (DDO) under real operating conditions
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.microrel.2023.115019&Exemplar=1&LAN=DE A1 Ghenam, Sinda A1 El Hami, Abdelkhalak A1 Gafsi, Wajih A1 Akrout, Ali A1 Haddar, Mohamed PB Elsevier BV YR 2023 SN 0026-2714 JF Microelectronics Reliability VO 146 SP 115019 LK http://dx.doi.org/https://doi.org/10.1016/j.microrel.2023.115019 DO https://doi.org/10.1016/j.microrel.2023.115019 SF ELIB - SuUB Bremen
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