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1 Ergebnisse
1
Interface stress analysis and bonding strengthening explora..:
Shao, Jing
;
Wang, Yingming
;
Zhu, Karl
...
Microelectronics Reliability. 155 (2024) - p. 115369 , 2024
Link:
https://doi.org/10.1016/j.microrel.2024.115369
RT Journal T1
Interface stress analysis and bonding strengthening exploration of metal layer on the laser-activated copper-clad AlN
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.microrel.2024.115369&Exemplar=1&LAN=DE A1 Shao, Jing A1 Wang, Yingming A1 Zhu, Karl A1 Sun, Zhiyuan A1 Han, Suli A1 Dong, Hao A1 Sun, Shufeng A1 Song, Ping A1 Zhang, Ruolan PB Elsevier BV YR 2024 SN 0026-2714 JF Microelectronics Reliability VO 155 SP 115369 LK http://dx.doi.org/https://doi.org/10.1016/j.microrel.2024.115369 DO https://doi.org/10.1016/j.microrel.2024.115369 SF ELIB - SuUB Bremen
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