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1 Ergebnisse
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Two-step sub-modeling framework for thermomechanical fatigu..:
Lee, Hyun Suk
;
Yun, Giseok
;
Song, Ju-Hwan
.
Microelectronics Reliability. 160 (2024) - p. 115469 , 2024
Link:
https://doi.org/10.1016/j.microrel.2024.115469
RT Journal T1
Two-step sub-modeling framework for thermomechanical fatigue analysis of solder joints in DRAM module
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.microrel.2024.115469&Exemplar=1&LAN=DE A1 Lee, Hyun Suk A1 Yun, Giseok A1 Song, Ju-Hwan A1 Kim, Do-Nyun PB Elsevier BV YR 2024 SN 0026-2714 JF Microelectronics Reliability VO 160 SP 115469 LK http://dx.doi.org/https://doi.org/10.1016/j.microrel.2024.115469 DO https://doi.org/10.1016/j.microrel.2024.115469 SF ELIB - SuUB Bremen
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