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1 Ergebnisse
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TEM investigation of interfacial microstructure and fractur..:
Ho, C.E.
;
Lu, M.K.
;
Lee, P.T.
..
Materials Science and Engineering: A. 706 (2017) - p. 269-278 , 2017
Link:
https://doi.org/10.1016/j.msea.2017.08.116
RT Journal T1 <Title>TEM investigation of interfacial microstructure and fracture mode of the Sn-Ag-Cu/Ni joint system</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.msea.2017.08.116&Exemplar=1&LAN=DE A1 Ho, C.E. A1 Lu, M.K. A1 Lee, P.T. A1 Huang, Y.H. A1 Chou, W.L. PB Elsevier BV YR 2017 SN 0921-5093 JF Materials Science and Engineering: A VO 706 SP 269 OP 278 LK http://dx.doi.org/https://doi.org/10.1016/j.msea.2017.08.116 DO https://doi.org/10.1016/j.msea.2017.08.116 SF ELIB - SuUB Bremen
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