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1 Ergebnisse
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Interfacial bonding and microstructural evolution in Incone..:
Liu, Kun
;
Yan, Zhaoyang
;
Pan, Rui
...
Materials Science and Engineering: A. 898 (2024) - p. 146381 , 2024
Link:
https://doi.org/10.1016/j.msea.2024.146381
RT Journal T1 <Title>Interfacial bonding and microstructural evolution in Inconel-copper bimetallic structures fabricated by directed energy deposition-arc</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.msea.2024.146381&Exemplar=1&LAN=DE A1 Liu, Kun A1 Yan, Zhaoyang A1 Pan, Rui A1 Wang, Xiaowei A1 Wang, Fude A1 Chen, Shujun PB Elsevier BV YR 2024 SN 0921-5093 JF Materials Science and Engineering: A VO 898 SP 146381 LK http://dx.doi.org/https://doi.org/10.1016/j.msea.2024.146381 DO https://doi.org/10.1016/j.msea.2024.146381 SF ELIB - SuUB Bremen
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