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The impact of silicon brick polishing on thin (120 μm) sili..:
Sekhar, Halubai
;
Fukuda, Tetsuo
;
Tanahashi, Katsuto
.
Materials Science in Semiconductor Processing. 105 (2020) - p. 104751 , 2020
Link:
https://doi.org/10.1016/j.mssp.2019.104751
RT Journal T1
The impact of silicon brick polishing on thin (120 μm) silicon wafer sawing yields and fracture strengths in diamond-wire sawing
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mssp.2019.104751&Exemplar=1&LAN=DE A1 Sekhar, Halubai A1 Fukuda, Tetsuo A1 Tanahashi, Katsuto A1 Takato, Hidetaka PB Elsevier BV YR 2020 SN 1369-8001 JF Materials Science in Semiconductor Processing VO 105 SP 104751 LK http://dx.doi.org/https://doi.org/10.1016/j.mssp.2019.104751 DO https://doi.org/10.1016/j.mssp.2019.104751 SF ELIB - SuUB Bremen
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