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1 Ergebnisse
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Mechanical strength problem of thin silicon wafers (120 and..:
Sekhar, Halubai
;
Fukuda, Tetsuo
;
Tanahashi, Katsuto
...
Materials Science in Semiconductor Processing. 119 (2020) - p. 105209 , 2020
Link:
https://doi.org/10.1016/j.mssp.2020.105209
RT Journal T1
Mechanical strength problem of thin silicon wafers (120 and 140 μm) cut with thinner diamond wires (Si kerf 120 → 100 μm) for photovoltaic use
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mssp.2020.105209&Exemplar=1&LAN=DE A1 Sekhar, Halubai A1 Fukuda, Tetsuo A1 Tanahashi, Katsuto A1 Takato, Hidetaka A1 Ono, Hiromichi A1 Sampei, Yoshiyuki A1 Kobayashi, Tsubasa PB Elsevier BV YR 2020 SN 1369-8001 JF Materials Science in Semiconductor Processing VO 119 SP 105209 LK http://dx.doi.org/https://doi.org/10.1016/j.mssp.2020.105209 DO https://doi.org/10.1016/j.mssp.2020.105209 SF ELIB - SuUB Bremen
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